IPM，光耦，晶振系列
| 封裝名稱 | 管腳數 | 封裝尺寸（長*寬）/mm | 封裝厚度(mm) | 管腳間距/mm | 備注 |
| DIP8-PVG | 8 | 9.35x6.3 | 3.4 | 2.54 | 光耦 |
| SOIC/14LD-S | 14 | 10.1x5.0 | 3.2 | 1.27 | 晶振 |
| IPM-SOP23 | 23 | 29x12 | 3.15 | 1.778 | |
| IPM-DIP23 | 23 | 29x12 | 3.15 | 3.9/1.95 | |
| IPM-DIP24 | 24 | 29.3x18 | 4.3 | 1 | |
| IPM-DIP26 | 26 | 42x23 | 5 | 1.78 | |
| IPM-HDIP26 | 26 | 32x13 | 3.6 | 2 |
